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Solder ball
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1	CSP and micro-BGA Process and Damage Assessment with Acoustic Micro Imaging (AMI) Steven R. Martell and J.E. Semmens SONOSCAN IncE. Pratt Blvd. Elk Grove Village, IL 60007 Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Electronic engineering Electrical engineering Electromagnetism Semiconductor device fabrication Packaging Electronics manufacturing Ball grid array Surface-mount technology Solder Reflow soldering Integrated circuit packaging Reliability
2	Assembly Guide for the KAPtery SkyShield Kit User manual, parts list, circuit design, and Arduino sketch at KAPtery.com/guides Technical support: http://kaptery.com/contact/ The SkyShield is a custom circuit board which Add to Reading List Source URL: kaptery.com Language: English - Date: 2015-12-27 20:37:07 Electronic engineering Electronics Electromagnetism Electronics manufacturing Soldering Arduino Printed circuit board Solder Dual in-line package PCB Desoldering Ball grid array
3	Ridgetop Group, IncNorth Oracle Road Tucson, AZPhone: (Fax: (www.RidgetopGroup.com Add to Reading List Source URL: www.ridgetopgroup.com Language: English - Date: 2015-07-18 01:30:08 Fabless semiconductor companies Electronics manufacturing Reconfigurable computing Semiconductor devices Xilinx Field-programmable gate array Altera Prognostics Ball grid array Restriction of Hazardous Substances Directive Built-in self-test Solder
4	MICROELECTRONICS ASSEMBLY Microelectronics Assembly With over four decades of experience in high reliability hybrid and RF technologies, NEO Tech has emerged as North America’s largest microelectronics assembler. The m Add to Reading List Source URL: www.neotech.com Language: English - Date: 2016-01-20 13:47:56 Semiconductor device fabrication Solder Reliability Integrated circuit Welding Wire bonding Flip chip Ball grid array Flux
5	Vapor Phase Reflow Soldering Helps Eliminate Manufacturability Challenges Vapor Phase Reflow Soldering Helps Eliminate Manufacturability Challenges BY LEONARD LACHMANN AND SERGIO CORCUERA Add to Reading List Source URL: www.ibl-tech.com Language: English - Date: 2015-10-08 04:00:05 Electronics manufacturing Reflow soldering Soldering Selective soldering Rework Flux Wave soldering Solder Printed circuit board Ball grid array Thermal management Quad Flat No-leads package
6	A Low-Power Sensor Design, SJ Monitor, for Monitoring 24x7 the Health of BGA Solder Joints Add to Reading List Source URL: www.ridgetopgroup.com Language: English - Date: 2015-07-18 01:30:09 Electronics manufacturing Electronic design Ball grid array Surface-mount technology Solder Field-programmable gate array Printed circuit board Restriction of Hazardous Substances Directive Xilinx Automated X-ray inspection Physics of failure System on a chip
7	Production Test Chip-scale packages: Inspection methods for diverse designs Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Packaging Electronics manufacturing Semiconductor device fabrication Solder ball Rework Flip chip Solder Chip-scale package Reliability Automated X-ray inspection Integrated circuit packaging Flux
8	SI00-06 Surging Ideas TVS Diode Application Note PROTECTION PRODUCTS Semtech utilizes a proprietary electroless nickel plate Add to Reading List Source URL: www.semtech.com Language: English - Date: 2013-04-03 13:11:08 Electronic engineering Engineering Electronics manufacturing Manufacturing Solder ball Surface-mount technology Solder paste Solder Flip chip Printed circuit board Reflow soldering Thermal profiling
9	SI00-06 Surging Ideas TVS Diode Application Note PROTECTION PRODUCTS Semtech utilizes a proprietary electroless nickel plate Add to Reading List Source URL: www.semtech.com Language: English - Date: 2013-04-03 13:11:08 Electronics manufacturing Solder ball Surface-mount technology Solder paste Solder Flip chip Printed circuit board Reflow soldering Hot air solder leveling Thermal profiling Flux Chip-scale package
10	TM SchmartBoard, Incfax) www.schmartboard.com Add to Reading List Source URL: www.electronicaestudio.com Language: English - Date: 2011-01-06 11:18:05 Electromagnetism Surface-mount technology Printed circuit board Soldering Ball grid array Solder Dual in-line package Quad Flat Package Integrated circuit Electronics manufacturing Electronics Electronic engineering

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